The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 02, 2021

Filed:

Jan. 23, 2020
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Shinya Onodera, Tokyo, JP;

Takehisa Tamura, Tokyo, JP;

Ken Morita, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/248 (2006.01); H01G 4/30 (2006.01); H01G 4/232 (2006.01); H01G 4/12 (2006.01);
U.S. Cl.
CPC ...
H01G 4/248 (2013.01); H01G 4/2325 (2013.01); H01G 4/30 (2013.01); H01G 4/1227 (2013.01);
Abstract

An electronic component includes an element body including a plurality of side surfaces adjacent to each other, and an external electrode disposed on the plurality of side surfaces. The external electrode includes a conductive resin layer in which a plurality of gaps exists and a plating layer disposed on the conductive resin layer. A clearance communicating with the plurality of gaps exists between an end edge of the plating layer and the element body. The conductive resin layer includes a first portion located on one side surface of the plurality of side surfaces and a second portion located on another side surface of the plurality of side surfaces. An existence ratio of the gaps in the first portion is greater than an existence ratio of the gaps in the second portion.


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