The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 02, 2021

Filed:

Mar. 22, 2018
Applicant:

Tdk Corporation, Tokyo, JP;

Inventor:

Masanori Suzuki, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 27/28 (2006.01); H01F 27/29 (2006.01); H01F 41/12 (2006.01); H01F 41/04 (2006.01); H01F 27/32 (2006.01); H01F 27/38 (2006.01); H01F 3/10 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2876 (2013.01); H01F 27/292 (2013.01); H01F 27/323 (2013.01); H01F 41/04 (2013.01); H01F 41/122 (2013.01); H01F 3/10 (2013.01); H01F 27/38 (2013.01);
Abstract

In a coil component, in an upper coil portion, a winding end portion constituting an end portion is connected to a lead-out conductor. Accordingly, the lead-out conductor can absorb heat from the winding end portion and can dissipate heat to the outside via a terminal electrode. Moreover, the lead-out conductor is formed to cover a winding adjacent portion. Accordingly, heat can also be absorbed from the winding adjacent portion and can be dissipated to the outside via the terminal electrode. That is, in the coil component described above, since the lead-out conductor absorbs heat not only from the winding end portion but also from the winding adjacent portion, improvement of heat dissipation properties is realized in the coil component.


Find Patent Forward Citations

Loading…