The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 2021
Filed:
Sep. 20, 2019
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Gregory Keith Cestra, Pleasanton, CA (US);
Andrew Strachan, Santa Clara, CA (US);
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Primary Examiner:
Int. Cl.
CPC ...
H01C 7/06 (2006.01); H01C 17/24 (2006.01); H01C 7/00 (2006.01); G01K 7/01 (2006.01); H01L 49/02 (2006.01); H01C 17/242 (2006.01); H01C 13/02 (2006.01); H01L 27/08 (2006.01);
U.S. Cl.
CPC ...
H01C 7/008 (2013.01); G01K 7/01 (2013.01); H01C 7/006 (2013.01); H01C 7/06 (2013.01); H01C 13/02 (2013.01); H01C 17/24 (2013.01); H01C 17/242 (2013.01); H01L 28/20 (2013.01); H01L 27/0802 (2013.01);
Abstract
Methods and apparatus providing a vertically constructed, temperature sensing resistor are disclosed. An example apparatus includes a semiconductor substrate including a plurality of resistor unit cells arranged in an array, each resistor unit cell formed within the semiconductor substrate and including a top contact. A conductive layer located over the semiconductor substrate electrically connects to a subset of the top contacts.