The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 2021
Filed:
Jul. 20, 2020
Applicant:
Jx Nippon Mining & Metals Corporation, Tokyo, JP;
Inventor:
Shin-ichi Ogino, Ibaraki, JP;
Assignee:
JX Nippon Mining & Metals Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/65 (2006.01); C23C 14/34 (2006.01); G11B 5/851 (2006.01); C22C 32/00 (2006.01); C22C 33/02 (2006.01); H01F 41/18 (2006.01); C22C 5/04 (2006.01); C22C 38/00 (2006.01); C22C 38/16 (2006.01); C30B 29/16 (2006.01); C30B 29/38 (2006.01); H01F 1/33 (2006.01); H01F 10/12 (2006.01); C22C 1/05 (2006.01); C22C 1/04 (2006.01);
U.S. Cl.
CPC ...
G11B 5/653 (2013.01); C22C 5/04 (2013.01); C22C 32/0005 (2013.01); C22C 33/02 (2013.01); C22C 33/0278 (2013.01); C22C 33/0292 (2013.01); C22C 38/002 (2013.01); C22C 38/16 (2013.01); C23C 14/3414 (2013.01); C30B 29/16 (2013.01); C30B 29/38 (2013.01); G11B 5/65 (2013.01); G11B 5/851 (2013.01); H01F 1/33 (2013.01); H01F 41/183 (2013.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01); C22C 1/0466 (2013.01); C22C 1/051 (2013.01); H01F 10/123 (2013.01);
Abstract
Provided is an Fe—Pt based magnetic material sintered compact, comprising BN and SiOas non-magnetic materials, wherein Si and O are present in a region where B or N is present at a cut surface of the sintered compact. A high density sputtering target is provided which enables production of a magnetic thin film for heat-assisted magnetic recording media, and also reduces the amount of particles generated during sputtering.