The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 2021
Filed:
Aug. 26, 2019
Sony Corporation, Tokyo, JP;
Hiroto Kawaguchi, Kanagawa, JP;
Shogo Shinkai, Kanagawa, JP;
Kei Tsukamoto, Kanagawa, JP;
Tomoko Katsuhara, Kanagawa, JP;
Hayato Hasegawa, Kanagawa, JP;
Fumihiko Iida, Kanagawa, JP;
Takayuki Tanaka, Kanagawa, JP;
Tomoaki Suzuki, Kanagawa, JP;
Taizo Nishimura, Kanagawa, JP;
Hiroshi Mizuno, Kanagawa, JP;
Yasuyuki Abe, Kanagawa, JP;
Sony Corporation, Tokyo, JP;
Abstract
The sensor device includes a first conductive layer, a second conductive layer, an electrode substrate, a first support, and a second support. The first conductive layer is formed to be deformable sheet-shaped. The second conductive layer is disposed to be opposed to the first conductive layer. The electrode substrate includes multiple first electrode wires and multiple second electrode wires and is disposed to be deformable between the first conductive layer and the second conductive layer, the multiple second electrode wires being disposed to be opposed to the multiple first electrode wires and intersecting with the multiple first electrode wires. The first support includes multiple first structures, the multiple first structures connecting the first conductive layer and the electrode substrate. The second support includes multiple second structures, the multiple second structures connecting the second conductive layer and the electrode substrate.