The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 2021
Filed:
Feb. 23, 2018
Applicant:
Corning Incorporated, Corning, NY (US);
Inventors:
Michael Lucien Genier, Horseheads, NY (US);
John Tyler Keech, Painted Post, NY (US);
Robert Sabia, Parkland, FL (US);
Assignee:
Corning Incorporated, Corning, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 1/11 (2015.01); H01L 27/12 (2006.01); H01L 21/68 (2006.01); C03C 17/00 (2006.01); C03C 3/06 (2006.01); C03C 1/00 (2006.01);
U.S. Cl.
CPC ...
G02B 1/11 (2013.01); C03C 1/00 (2013.01); C03C 3/06 (2013.01); C03C 17/002 (2013.01); C03C 2201/42 (2013.01); C03C 2217/73 (2013.01); C03C 2217/732 (2013.01);
Abstract
A glass wafer having a first major surface, a second major surface that is parallel to and opposite of the first major surface, a thickness between the first major surface and the second major surface, and an annular edge portion that extends from an outermost diameter of the glass wafer toward the geometrical center of the glass wafer. The glass wafer has a diameter from greater than or equal to 175 mm to less than or equal to 325 mm and a thickness of less than 0.350 mm. A width of the edge portion is less than 10 mm.