The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 2021
Filed:
Aug. 31, 2018
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventor:
Shuichi Kawano, Suwa, JP;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01P 15/125 (2006.01); G01C 19/00 (2013.01); G01P 15/08 (2006.01); G01C 19/5705 (2012.01);
U.S. Cl.
CPC ...
G01P 15/125 (2013.01); G01C 19/00 (2013.01); G01C 19/5705 (2013.01); G01P 2015/0814 (2013.01);
Abstract
In a physical quantity sensor, wirings provided on a projection and a bonding pad form a silicide layer and are electrically connected. The wirings are multilayered films. A noble metal layer covers the projection and contacts the bonding pad to form the silicide layer. A metal layer extends between the noble metal layer and a base substrate. The metal layer, the noble metal layer, an adhesion layer, and an insulating layer are stacked in this order from the base substrate in all areas except for atop the projection.