The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 2021
Filed:
Apr. 15, 2020
Hitachi Automotive Systems, Ltd., Hitachinaka, JP;
Noboru Tokuyasu, Hitachinaka, JP;
Shinobu Tashiro, Hitachinaka, JP;
Keiji Hanzawa, Hitachinaka, JP;
Takeshi Morino, Hitachinaka, JP;
Ryosuke Doi, Hitachinaka, JP;
Akira Uenodan, Hitachinaka, JP;
Hitachi Automotive Systems, Ltd., Hitachinaka, JP;
Abstract
The present invention has been made to improve measurement accuracy of a thermal flow meter. In the thermal flow meter according to the invention, a circuit package () that measures a flow rate is molded in a first resin molding process. In a second resin molding process, a housing () having an inlet trench (), a bypass passage trench on frontside (), an outlet trench (), and the like are formed through resin molding, and an outer circumferential surface of the circuit package () produced in the first resin molding process is enveloped by a resin in the second resin molding process to fix the circuit package () to the housing ().