The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 02, 2021

Filed:

Dec. 07, 2018
Applicant:

Climate Master, Inc., Oklahoma City, OK (US);

Inventors:

Michael F. Taras, Oklahoma City, OK (US);

Puya Javidmand, Oklahoma City, OK (US);

Assignee:

Climate Master, Inc., Oklahoma City, OK (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
F24F 3/14 (2006.01); F25B 30/02 (2006.01); F25B 41/04 (2006.01); F24F 11/00 (2018.01); F25B 40/02 (2006.01); F25B 41/06 (2006.01); F24F 3/153 (2006.01); F25B 6/04 (2006.01); F25B 13/00 (2006.01);
U.S. Cl.
CPC ...
F24F 3/1405 (2013.01); F24F 3/153 (2013.01); F24F 11/0008 (2013.01); F25B 6/04 (2013.01); F25B 13/00 (2013.01); F25B 30/02 (2013.01); F25B 40/02 (2013.01); F25B 41/04 (2013.01); F25B 41/046 (2013.01); F25B 41/062 (2013.01); F24F 2003/1446 (2013.01); F24F 2003/1452 (2013.01); F25B 2313/005 (2013.01); F25B 2313/0212 (2013.01); F25B 2313/0292 (2013.01); F25B 2400/0403 (2013.01); F25B 2400/0411 (2013.01);
Abstract

Various embodiments of a heat pump system are disclosed to provide improved and flexible heat pump operation when dehumidification of the conditioned space is required. In one embodiment, a heat pump system includes a heat pump loop comprising a refrigerant circuit that fluidly interconnects (1) a compressor; (2) a source heat exchanger; (3) a source heat exchanger bypass circuit comprising a bypass valve; (4) a space heat exchanger; (5) a reversing valve positioned on the discharge side of the compressor; (6) a reheat circuit comprising a reheat heat exchanger; (7) first and second expansion devices; and (8) first and second expansion device bypass circuits configured to allow refrigerant to bypass the first and second expansion devices, respectively, where the first and second bypass circuits include first and second check valves, respectively; and (9) a 3-way valve configured to selectively direct refrigerant flow to the first expansion device, the reheat circuit, and the second expansion device.


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