The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 2021
Filed:
Dec. 06, 2018
Applicant:
Hwai-chung Wu, Ann Arbor, MI (US);
Inventor:
Hwai-Chung Wu, Ann Arbor, MI (US);
Assignee:
Other;
Primary Examiner:
Int. Cl.
CPC ...
D02G 3/44 (2006.01); B29C 70/16 (2006.01); D07B 1/16 (2006.01); D07B 5/00 (2006.01); D02G 3/40 (2006.01);
U.S. Cl.
CPC ...
D02G 3/447 (2013.01); B29C 70/16 (2013.01); D02G 3/404 (2013.01); D07B 1/16 (2013.01); D07B 5/006 (2015.07); D07B 2201/2006 (2013.01); D07B 2201/2009 (2013.01); D07B 2201/2012 (2013.01); D07B 2201/2087 (2013.01); D07B 2201/2092 (2013.01); D07B 2401/2055 (2013.01);
Abstract
The present invention relates to an engineered fiber bundle for reinforcement of composite materials. Specifically, the engineered fiber bundles of the present invention enhance the tensile behavior of the composites reinforced with the fiber bundles. Methods of making the same are further provided.
Wu, Hwai-Chung. (2021). Engineered fiber bundles for reinforcing composite materials (U.S. Patent No. 10934638). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10934638
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile