The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 02, 2021

Filed:

Dec. 29, 2016
Applicant:

Ltc Co., Ltd, Gyeonggi-do, KR;

Inventors:

Jun Young Kim, Gyeonggi-do, KR;

Hwa Young Kim, Gyeonggi-do, KR;

Ho Sung Choi, Gyeonggi-do, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 83/06 (2006.01); C09D 183/06 (2006.01); C08K 5/5415 (2006.01); C08G 77/16 (2006.01); C09D 7/20 (2018.01); C08G 77/04 (2006.01); C08G 77/14 (2006.01); H05K 1/03 (2006.01); C09D 7/65 (2018.01); H01L 27/12 (2006.01); C08G 77/24 (2006.01); C08G 77/00 (2006.01);
U.S. Cl.
CPC ...
C09D 183/06 (2013.01); C08G 77/045 (2013.01); C08G 77/14 (2013.01); C08G 77/16 (2013.01); C08K 5/5415 (2013.01); C08L 83/06 (2013.01); C09D 7/20 (2018.01); H05K 1/0326 (2013.01); C08G 77/24 (2013.01); C08G 77/70 (2013.01); C08G 2150/00 (2013.01); C09D 7/65 (2018.01); H01L 27/1218 (2013.01); H01L 27/1266 (2013.01); H05K 1/0393 (2013.01); H05K 2201/0108 (2013.01); H05K 2201/10128 (2013.01);
Abstract

The present invention relates to a polysilsesquioxane resin composition for a flexible substrate. More specifically, the present invention relates to a polysilsesquioxane resin composition for a flexible substrate, having excellent heat resistance and transparency, the resin composition being usable for a flexible display substrate. More specifically, a transparent thin film can be formed, excellent transmittance is exhibited in the visible range even after curing, heat resistance is excellent, and flexibility and crack resistance can be controlled. Compared to a conventional polyimide-based substrate material, the present invention has excellent insulation characteristics and passivation characteristics, which can be satisfied simultaneously, and is advantageous for productivity since release characteristics are ensured during a delamination process from a glass substrate.


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