The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 2021
Filed:
Feb. 07, 2019
Applicant:
Fujifilm Corporation, Tokyo, JP;
Inventors:
Assignee:
FUJIFILM CORPORATION, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
C09D 11/38 (2014.01); C08G 18/32 (2006.01); C08G 18/38 (2006.01); C09D 11/023 (2014.01); C08G 18/75 (2006.01); C09D 11/101 (2014.01); C08G 18/67 (2006.01); C08G 18/76 (2006.01); C08G 18/08 (2006.01); C08G 18/34 (2006.01); C09D 11/322 (2014.01); B41M 7/00 (2006.01);
U.S. Cl.
CPC ...
C09D 11/38 (2013.01); C08G 18/0823 (2013.01); C08G 18/0866 (2013.01); C08G 18/3212 (2013.01); C08G 18/3215 (2013.01); C08G 18/3234 (2013.01); C08G 18/348 (2013.01); C08G 18/381 (2013.01); C08G 18/3848 (2013.01); C08G 18/3872 (2013.01); C08G 18/675 (2013.01); C08G 18/755 (2013.01); C08G 18/757 (2013.01); C08G 18/758 (2013.01); C08G 18/7642 (2013.01); C09D 11/023 (2013.01); C09D 11/101 (2013.01); C09D 11/322 (2013.01); B41M 7/009 (2013.01); B41M 7/0072 (2013.01);
Abstract
There are provided an ink jet ink composition including water; and particles including a chain polymer including Unit (1), Unit (2), and a hydrophilic group and a polymerizable group, and an image forming method. Cyand Cyeach independently represent a divalent organic group having 3 to 30 carbon atoms including a ring, Yand Yeach independently represent an oxygen atom, a sulfur atom, or a —NR— group, Rrepresents a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms, *1 in Unit (1) represents a bonding position to a structural unit other than Unit (1), and *2 in Unit (2) represents a bonding position to a structural unit other than Unit (2).