The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 02, 2021

Filed:

Feb. 06, 2018
Applicant:

Toyobo Co., Ltd., Osaka, JP;

Inventors:

Shuji Kubota, Otsu, JP;

Nobuhiro Yoshimura, Otsu, JP;

Yuhei Fukumoto, Otsu, JP;

Kazuki Iwamura, Otsu, JP;

Kiyofumi Sakai, Kiyosu, JP;

Osamu Mabuchi, Kiyosu, JP;

Assignee:

TOYOBO CO., LTD., Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/24 (2006.01); C08L 77/00 (2006.01); C08K 3/04 (2006.01); C08L 23/06 (2006.01); C08L 23/08 (2006.01); C08L 23/26 (2006.01);
U.S. Cl.
CPC ...
C08L 77/00 (2013.01); C08K 3/04 (2013.01); C08L 23/06 (2013.01); C08L 23/0815 (2013.01); C08L 23/26 (2013.01); H01B 1/24 (2013.01); C08K 2201/001 (2013.01); C08L 2205/03 (2013.01); C08L 2207/062 (2013.01); C08L 2312/00 (2013.01);
Abstract

Disclosed is a conductive polyamide resin composition that excels not only in electroconductivity, but also in fuel resistance, particularly resistance against alcohol-containing fuel, and further excels in fluidity and moldability, and is capable of yielding a molded article with high impact resistance, the conductive polyamide resin composition including: 84 to 40% by mass of a polyamide resin (A); 5 to 30% by mass of conductive carbon black (B); 3 to 30% by mass of an ethylene-α-olefin copolymer (C) that has a reactive functional group capable of reacting with a terminal group of polyamide resin and/or an amido group on a principal chain of polyamide resin; and 1 to 20% by mass of a conductive polyethylene resin (D).


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