The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 2021
Filed:
Jun. 03, 2019
Applicant:
Sae Magnetics (H.k.) Ltd., Hong Kong, HK;
Inventors:
Masashi Shiraishi, Hong Kong, HK;
Akio Nakao, Hong Kong, HK;
Assignee:
SAE Magnetics (H.K.) Ltd., Hong Kong, HK;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); B81B 7/02 (2006.01); B81C 1/00 (2006.01); H04R 19/04 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0077 (2013.01); B81B 7/02 (2013.01); B81C 1/00333 (2013.01); H04R 19/04 (2013.01); B81B 2201/0257 (2013.01); B81B 2203/0127 (2013.01); B81B 2203/033 (2013.01); B81B 2207/09 (2013.01); B81C 2203/01 (2013.01);
Abstract
A MEMS package has a MEMS chip, a package substrate, a dammed-seal part. The MEMS chip has an element substrate which a movable element is formed, the element substrate has an element hole-part which the movable element is arranged. The dammed-seal part has an annular dam-member which is formed on the element substrate so as to surround the element hole-part and a gel member. The gel member is formed by hardening of gel which is applied on the annular dam-member.