The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 02, 2021

Filed:

Apr. 27, 2017
Applicant:

Warwick Mills Inc., New Ipswich, NH (US);

Inventor:

Charles A Howland, Temple, NH (US);

Assignee:

Warwick Mills, Inc., New Ipswich, NH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B60C 9/04 (2006.01); B60C 9/14 (2006.01); B60C 15/00 (2006.01); B60C 5/14 (2006.01); B60C 9/02 (2006.01); B60C 9/20 (2006.01);
U.S. Cl.
CPC ...
B60C 15/0072 (2013.01); B60C 15/0009 (2013.01); B60C 15/0036 (2013.01); B60C 2005/147 (2013.01); B60C 2009/0269 (2013.01); B60C 2009/0408 (2013.01); B60C 2009/0475 (2013.01); B60C 2009/2064 (2013.01);
Abstract

A tire having reduced mass and low rolling resistance and a method of manufacture thereof achieves reduced weight by using thin layers of thermoplastic polyurethanes ('TPU's') to heat seal the carcass, breaker, and tread layers of the tire to each other, rather than embedding the layers in conventional, relatively thicker and heavier layers of sulfur cured vulcanized carbon filled elastomers. Creep and 'spring-back' of the thermoplastic polyurethanes during cure is avoided by maintaining the adhered layers under pressure until the assembly cools below its glass transition temperature. In embodiments, the heat sealing can be performed on the forming drum, and in some embodiments cool rollers are applied to the heat-sealed carcass so as to accelerate the cooling to below the glass transition temperature.


Find Patent Forward Citations

Loading…