The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 2021
Filed:
Aug. 30, 2018
Applicant:
Celanese Sales Germany Gmbh, Taunus, DE;
Inventors:
Assignee:
Celanese Sales Germany GmbH, Taunus, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 67/20 (2006.01); C08J 9/24 (2006.01); C02F 1/00 (2006.01); B01D 69/02 (2006.01); C02F 3/20 (2006.01); C08J 9/00 (2006.01); B01D 39/16 (2006.01); B01D 67/00 (2006.01); B43K 1/00 (2006.01); B01D 71/26 (2006.01); B29C 67/04 (2017.01); C08F 210/02 (2006.01); C08L 23/06 (2006.01); C02F 103/10 (2006.01); C02F 101/32 (2006.01); C02F 103/44 (2006.01); C02F 103/02 (2006.01); B29L 31/14 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B29C 67/20 (2013.01); B01D 39/1661 (2013.01); B01D 67/0002 (2013.01); B01D 69/02 (2013.01); B01D 71/26 (2013.01); B29C 67/04 (2013.01); B43K 1/006 (2013.01); C02F 1/001 (2013.01); C02F 3/20 (2013.01); C08F 210/02 (2013.01); C08J 9/0061 (2013.01); C08J 9/24 (2013.01); C08L 23/06 (2013.01); B01D 2239/10 (2013.01); B01D 2325/24 (2013.01); B01D 2325/34 (2013.01); B29K 2023/06 (2013.01); B29L 2031/14 (2013.01); B29L 2031/725 (2013.01); B29L 2031/748 (2013.01); C02F 2101/32 (2013.01); C02F 2101/325 (2013.01); C02F 2103/023 (2013.01); C02F 2103/10 (2013.01); C02F 2103/44 (2013.01); C08F 2500/02 (2013.01); C08F 2500/05 (2013.01); C08F 2500/18 (2013.01); C08F 2500/24 (2013.01); C08J 2323/06 (2013.01); C08J 2423/06 (2013.01); C08L 2205/025 (2013.01); C08L 2207/068 (2013.01); C08L 2314/02 (2013.01); Y10T 428/249979 (2015.04);
Abstract
Polymer compositions containing polyethylene particles having a multi-modal molecular weight distribution are disclosed. The polymer compositions are well suited to producing porous substrates through a sintering process. Formulations made according to the present disclosure can produce porous substrates having improved flexibility demonstrated by an increased flexural strength while still retaining excellent pressure drop characteristics.