The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 02, 2021

Filed:

Sep. 04, 2017
Applicant:

Yoshino Kogyosho Co., Ltd., Tokyo, JP;

Inventors:

Shinichi Tabata, Tokyo, JP;

Mitsuru Shiokawa, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 49/46 (2006.01); B29C 49/58 (2006.01); B29C 49/64 (2006.01); B29C 49/06 (2006.01); B29C 49/12 (2006.01); B29C 49/66 (2006.01); B29D 22/00 (2006.01);
U.S. Cl.
CPC ...
B29C 49/06 (2013.01); B29C 49/12 (2013.01); B29C 49/46 (2013.01); B29C 49/58 (2013.01); B29C 49/66 (2013.01); B29D 22/003 (2013.01);
Abstract

A liquid blow molding apparatus comprises: a mold () in which a preform () is to be placed; and a nozzle unit () having a supply port () capable of supplying a liquid from above into the preform () placed in the mold (), wherein the nozzle unit () includes a seal body () that is movable among a closed position at which supply of the liquid through the supply port () is blocked, a first open position at which supply of the liquid through only part of the supply port () in a circumferential direction is allowed, and a second open position at which supply of the liquid through the whole supply port () in the circumferential direction is allowed.


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Tabata, Shinichi. (2021). Liquid blow molding apparatus and liquid blow molding method (U.S. Patent No. 10933573). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10933573

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