The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10933568 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 02, 2021

Filed:

Apr. 11, 2018
Applicant:

Toyota Boshoku Kabushiki Kaisha, Aichi-ken, JP;

Inventor:

Hideo Kamiya, Aichi-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 70/08 (2006.01); B29C 45/14 (2006.01); B29L 31/30 (2006.01);
U.S. Cl.
CPC ...
B29C 45/14508 (2013.01); B29C 70/08 (2013.01); B29C 2045/14893 (2013.01); B29K 2995/0012 (2013.01); B29L 2031/3041 (2013.01); B32B 2262/02 (2013.01); B32B 2262/06 (2013.01); Y10T 428/24603 (2015.01);
Abstract

To provide a resin molding and a method for producing the same. A resin molding in which two types of substrates differing in thermal shrinkage are connected together, wherein the thermal shrinkage of a connection part of the two types of substrates is a value between the respective thermal shrinkages of the two types of substrates. It is preferred that the connection part be constituted of an end part of any one substrate of the two substrates. More specifically, there can be adopted an embodiment in which one substrate is a plate-like substrate including reinforcing fibers and a first thermoplastic resin binding the reinforcing fibers to each other and the other substrate is an injection-molded member connected in the plate face direction of the one substrate, wherein the thermal shrinkage of the other substrate is large as compared to the thermal shrinkage of the one substrate. Moreover, the connection part can be formed by adjusting the filling density of reinforcing fibers in an end part of the one substrate to be lower than the filling density of reinforcing fibers in the base part of the one substrate.


Find Patent Forward Citations

Kamiya, Hideo. (2021). Resin molding and method for producing the same (U.S. Patent No. 10933568). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10933568

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