The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 02, 2021

Filed:

Aug. 02, 2018
Applicant:

Lincoln Global, Inc., Santa Fe Springs, CA (US);

Inventors:

Steven R. Peters, Huntsburg, OH (US);

Andrew R. Peters, Chesterland, OH (US);

William T. Matthews, Chesterland, OH (US);

Assignee:

LINCOLN GLOBAL, INC., Santa Fe Springs, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 9/04 (2006.01); B23K 26/34 (2014.01); B23K 26/354 (2014.01); B33Y 40/00 (2020.01); B33Y 30/00 (2015.01); B33Y 10/00 (2015.01); B23K 26/342 (2014.01); B29C 64/00 (2017.01); B22F 3/00 (2021.01); B23K 9/32 (2006.01); B28B 1/00 (2006.01); B23K 103/00 (2006.01); B23K 103/02 (2006.01);
U.S. Cl.
CPC ...
B23K 26/34 (2013.01); B22F 3/00 (2013.01); B22F 3/008 (2013.01); B23K 9/044 (2013.01); B23K 9/324 (2013.01); B23K 26/342 (2015.10); B23K 26/354 (2015.10); B28B 1/001 (2013.01); B29C 64/00 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 40/00 (2014.12); B23K 2103/02 (2018.08); B23K 2103/52 (2018.08);
Abstract

Embodiments of systems and methods of additive manufacturing are disclosed. In one embodiment, a metal deposition device (MDD) is configured to deposit a metal material during an additive manufacturing process. A controller is operatively coupled to the MDD and is configured to command the MDD to deposit the metal material on a base to form a contour of a part. The controller is configured to command the MDD to deposit the metal material on the base to form an infill pattern within a region outlined by the contour. The infill pattern is a wave shape having a wavelength. The controller is configured to command the metal deposition device to fuse the infill pattern to the metal contour at crossover points, where the infill pattern meets the contour, by applying energy at the crossover points and reducing a deposition rate of the metal material at the crossover points to prevent distorting the contour.


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