The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 02, 2021

Filed:

Jul. 24, 2019
Applicant:

Origin Company, Limited, Saitama, JP;

Inventors:

Yutaka Matsumoto, Saitama, JP;

Hiroshi Akama, Saitama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01J 4/00 (2006.01); B23K 3/08 (2006.01); B01J 4/02 (2006.01);
U.S. Cl.
CPC ...
B01J 4/008 (2013.01); B01J 4/02 (2013.01); B23K 3/08 (2013.01); B01J 2219/00162 (2013.01); B01J 2219/00182 (2013.01);
Abstract

To provide a reducing gas supplying apparatus and a method for manufacturing a processed target object, which are capable of supplying a reducing liquid without causing it to scatter. The reducing gas supplying apparatusincludes a chamberdefining a space where soldering is performed on a target object T, a vaporizerfor generating a reducing gas FG to be supplied into the chamberby receiving a reducing liquid FL to be converted into the reducing gas FG and vaporizing the reducing liquid FL, an intermediate containerfor temporarily reserving the reducing liquid FL before the reducing liquid FL in a reducing liquid bottleis introduced into the vaporizer, a transport tube, a supply tube, a transport partfor delivering the reducing liquid FL in the bottleinto the intermediate container, and a supply partfor delivering the reducing liquid FL in the intermediate containerinto the vaporizer. The method includes supplying the object T into the chamber, performing soldering on the object T while supplying the reducing gas FG into the chamber, and taking the object T on which the soldering has been performed out of the chamber


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