The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2021

Filed:

Mar. 08, 2019
Applicant:

Stanley Electric Co., Ltd., Tokyo, JP;

Inventor:

Akihiko Hanya, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/40 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 3/12 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4069 (2013.01); H05K 1/09 (2013.01); H05K 1/097 (2013.01); H05K 1/116 (2013.01); H05K 1/118 (2013.01); H05K 3/1283 (2013.01); H05K 3/4061 (2013.01); H05K 1/0393 (2013.01); H05K 3/1216 (2013.01); H05K 2201/0257 (2013.01); H05K 2201/0266 (2013.01); H05K 2201/0272 (2013.01); H05K 2201/09563 (2013.01); H05K 2203/107 (2013.01); H05K 2203/1131 (2013.01); H05K 2203/1476 (2013.01); H05K 2203/1484 (2013.01);
Abstract

Provided is a circuit board for reducing a likelihood of so-called through-hole disconnection, and enhancing connection reliability on both sides of a substrate via a through-hole. The circuit board has a substrate with the through-hole, a first conductive part covering an opening of the through-hole on one surface of the substrate in a manner blocking the opening, having a portion inserted into the through-hole from the one surface, and a second conductive part covering a second opening of the through-hole on the other surface of the substrate in a manner blocking the second opening, having a portion inserted into the through-hole from the other surface. The portion of the first conductive part inserted in the through-hole has a columnar shape forming a columnar portion having a diameter smaller than the through-hole. The portion of the second conductive part inserted in the through-hole has a shape that fills a gap between the columnar portion of the first conductive part and an inner surface of the through-hole. Both of the first and the second conductive parts comprise conductive particles being sintered.


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