The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2021

Filed:

Jul. 17, 2019
Applicant:

Ut-battelle, Llc, Oak Ridge, TN (US);

Inventors:

Pooran C. Joshi, Oak Ridge, TN (US);

Stephen M. Killough, Oak Ridge, TN (US);

Phani Teja V. Kuruganti, Oak Ridge, TN (US);

Assignee:

UT-BATTELLE, LLC, Oak Ridge, TN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 1/20 (2006.01); H05K 1/02 (2006.01); H05K 3/28 (2006.01); H05K 1/09 (2006.01); H05K 3/12 (2006.01); G01R 15/00 (2006.01); G01R 19/00 (2006.01); H05K 1/16 (2006.01); G01R 15/16 (2006.01); G01R 21/06 (2006.01); G01R 35/00 (2006.01); G01R 15/18 (2006.01); G01R 19/25 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0277 (2013.01); G01R 1/203 (2013.01); G01R 15/00 (2013.01); G01R 15/16 (2013.01); G01R 15/18 (2013.01); G01R 19/0084 (2013.01); G01R 19/0092 (2013.01); G01R 19/2513 (2013.01); G01R 21/06 (2013.01); G01R 35/005 (2013.01); H05K 1/09 (2013.01); H05K 1/16 (2013.01); H05K 3/1283 (2013.01); H05K 3/28 (2013.01); H05K 2201/09227 (2013.01); H05K 2201/10151 (2013.01);
Abstract

A system and method (referred to as a method) to fabricate sensors and electronic circuits. The method prints a first thin-film having an electronic conductivity of about less than a millionth of a Siemens per meter and a permalloy directly onto the first thin-film. The permalloy has a magnetic permeability greater than a predetermined level and has a thickness within a range of about 1 to 20 microns. The system prints a second thin-film directly onto the permalloy to encapsulate the permalloy onto the first thin-film and prints conductive traces directly onto the surfaces of the first-thin-film, the permalloy, and the second thin-film. In some applications, a sensor is packaged in an additively manufactured three-dimensional cylindrical shape that can be mounted on or is a unitary part of a current carrying conductor without incising, sharing, or severing (e.g., cutting) the current carrying conductor or its insulation.


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