The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2021

Filed:

Sep. 11, 2017
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Alan Dean Martin, San Jose, CA (US);

Marc Davis-Marsh, San Jose, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H02M 3/06 (2006.01); H02M 7/00 (2006.01); H02M 1/44 (2007.01); H03H 7/00 (2006.01); H02H 9/00 (2006.01); H01L 27/01 (2006.01); H01G 2/06 (2006.01);
U.S. Cl.
CPC ...
H02M 3/06 (2013.01); H01L 27/016 (2013.01); H02H 9/001 (2013.01); H02M 1/44 (2013.01); H03H 7/004 (2013.01); H01G 2/06 (2013.01);
Abstract

A discrete field coupled capacitor with a cross-connected capacitor-pair, such as for use as a discrete bypass capacitor. The FCC includes a first port with first and second terminals, and a second port with third and fourth terminals. A first capacitor structure is connected between the first and second terminals, and a second capacitor structure connected between the third and fourth terminals. A cross-connect structure includes a first cross-connection to connect the first terminal to the third terminal, and a second cross-connection to connect the second terminal to the fourth terminal, to cross-connect the first and second capacitor structures. The capacitor structures have respective parasitic ESL, and can be disposed in proximity to effect a pre-defined ESL field coupling with reverse phasing to reduce parasitic ESL. The FCC can be constructed as a PCB or monolithic device. In a PCB four-layer construction, the cross-connections can be formed on respective mid-layers.


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