The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2021

Filed:

Jul. 31, 2019
Applicant:

Kaikutek Inc., Taipei, TW;

Inventors:

Yi-Cheng Lin, Taipei, TW;

Mike Chun-Hung Wang, Taipei, TW;

He-Sheng Lin, Taoyuan, TW;

Assignee:

KaiKuTek Inc., Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/52 (2006.01); H01Q 1/38 (2006.01); H01Q 9/04 (2006.01); H01Q 5/328 (2015.01);
U.S. Cl.
CPC ...
H01Q 1/526 (2013.01); H01Q 1/38 (2013.01); H01Q 5/328 (2015.01); H01Q 9/0407 (2013.01);
Abstract

An anti-EMI antenna includes a first substrate layer, a grounding layer, a first circuit layer, a second substrate layer, a second circuit layer, a third substrate layer, a third circuit layer, a fourth substrate layer, and a fourth circuit layer. The grounding layer is mounted on a bottom surface of the first substrate layer, and includes a grounding circuit. The grounding circuit fully covers the bottom surface of the first substrate layer. Since the grounding circuit fully covers the bottom surface of the first substrate layer, the antenna radiation circuit can prevent the EMI from a bottom side of the anti-EMI antenna. Therefore, electromagnetic waves can be mostly isolated to prevent noise caused by the EMI.


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