The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2021

Filed:

Jan. 29, 2020
Applicant:

Hitachi Metals, Ltd., Tokyo, JP;

Inventors:

Kazufumi Suenaga, Tokyo, JP;

Yuju Endo, Tokyo, JP;

Hideyuki Sagawa, Toyko, JP;

Takahiro Sugiyama, Toyko, JP;

Hiroshi Ishikawa, Toyko, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01P 3/06 (2006.01); H01P 11/00 (2006.01); H01B 13/00 (2006.01); H01B 13/016 (2006.01); H01B 13/06 (2006.01); H01B 11/18 (2006.01); H01P 3/02 (2006.01); H01B 3/44 (2006.01); H01B 11/20 (2006.01);
U.S. Cl.
CPC ...
H01P 3/06 (2013.01); H01B 11/1817 (2013.01); H01B 13/003 (2013.01); H01B 13/0167 (2013.01); H01B 13/06 (2013.01); H01P 3/02 (2013.01); H01P 11/005 (2013.01); H01B 3/441 (2013.01); H01B 11/20 (2013.01);
Abstract

A signal transmission cable includes a signal line, an insulation layer configured to cover the signal line, and a plating layer configured to cover the insulation layer. An arithmetic average roughness Ra of an outer peripheral surface of the insulation layer is between 0.6 μm and 10 μm inclusive. A method of manufacturing the signal transmission cable includes covering the signal line with the insulation layer, followed by conducting a dry-ice-blasting on the outer peripheral surface of the insulation layer, followed by conducting a corona discharge exposure process on the outer peripheral surface, and forming the plating layer on the outer peripheral surface.


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