The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2021

Filed:

Jan. 18, 2019
Applicant:

Nichia Corporation, Anan, JP;

Inventors:

Tomoaki Tsuruha, Anan, JP;

Noritsugu Uchiwa, Tokushima, JP;

Assignee:

NICHIA CORPORATION, Anan, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/50 (2010.01); H01L 33/48 (2010.01); H01L 33/56 (2010.01); H01L 33/54 (2010.01);
U.S. Cl.
CPC ...
H01L 33/502 (2013.01); H01L 33/486 (2013.01); H01L 33/507 (2013.01); H01L 33/54 (2013.01); H01L 33/56 (2013.01); H01L 33/501 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48257 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/96 (2013.01); H01L 2924/181 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0041 (2013.01);
Abstract

A method of manufacturing a light emitting device includes: providing particles of a fluorescent material; providing a substrate having a light emitting element mounted thereon; providing a first resin solution and a second resin solution that are two components of a two-component type curable resin; mixing the particles of the fluorescent material in the first resin solution to obtain a first suspension; allowing the first suspension to stand; mixing the second resin solution with the first suspension to obtain a second suspension after the allowing of the first suspension to stand; and applying the second suspension on the light emitting element and curing the second suspension to obtain a sealing member.


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