The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2021

Filed:

Mar. 17, 2020
Applicant:

Raytheon Company, Waltham, MA (US);

Inventors:

Hooman Kazemi, Waltham, MA (US);

Mark Rosker, Waltham, MA (US);

Thomas E. Kazior, Waltham, MA (US);

Shane A. O'Connor, Waltham, MA (US);

Emily Elswick, Waltham, MA (US);

Assignee:

Raytheon Company, Waltham, MA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/482 (2006.01); H01L 23/552 (2006.01); H01L 23/538 (2006.01); H01L 29/20 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
H01L 29/20 (2013.01); H01L 23/29 (2013.01); H01L 23/4822 (2013.01); H01L 23/5384 (2013.01); H01L 23/552 (2013.01);
Abstract

A reconstituted wafer includes a plurality of apertures defined in a first substrate. A module is positioned in each aperture and coupled to circuit traces on the first substrate by operation of beam leads extending from the module. A second substrate is positioned over the first substrate and each module is enclosed in a space defined by the respective aperture and the second substrate. The module includes a lid and at least one mode suppression circuit disposed in the lid. The modules may include an invariant die where different technologies are stacked together.


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