The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2021

Filed:

Mar. 14, 2019
Applicant:

Olympus Corporation, Tokyo, JP;

Inventors:

Takahiro Shimohata, Shiojiri, JP;

Takatoshi Igarashi, Ina, JP;

Assignee:

OLYMPUS CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); A61B 1/05 (2006.01); H01L 27/14 (2006.01); H04N 5/369 (2011.01); A61B 1/00 (2006.01); H04N 5/225 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14636 (2013.01); A61B 1/0011 (2013.01); A61B 1/05 (2013.01); A61B 1/051 (2013.01); H01L 27/14 (2013.01); H01L 27/14618 (2013.01); H01L 27/14632 (2013.01); H01L 27/14687 (2013.01); H04N 5/369 (2013.01); H04N 2005/2255 (2013.01);
Abstract

An image pickup unit includes: an image pickup device; a device laminate in which a plurality of semiconductor devices are laminated; and a signal cable having a lead wire and a shield lead wire. The plurality of semiconductor devices have cutouts. A groove in parallel with an optical axis direction is configured on a side surface of the device laminate by a plurality of the cutouts which communicate with one another. On cutout surfaces of the semiconductor devices, side electrodes are arranged. The lead wire and the shield lead wire are housed in the respective cutouts which have diameters in accordance with respective diameters of the lead wire and the shield lead wire. The lead wire is bonded to the side electrode and the shield lead wire is bonded to the side electrode.


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