The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2021

Filed:

May. 30, 2018
Applicant:

Nanyang Technological University, Singapore, SG;

Inventors:

Joseph Sylvester Chang, Singapore, SG;

Kwen Siong Chong, Singapore, SG;

Tong Lin, Singapore, SG;

Ne Kyaw Zwa Lwin, Singapore, SG;

Sivaramakrishnan Hariharakrishnan, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/06 (2006.01); H01L 21/8238 (2006.01); H01L 23/528 (2006.01); H01L 23/552 (2006.01); H01L 27/02 (2006.01); H01L 29/08 (2006.01); H03K 19/003 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0629 (2013.01); H01L 21/823871 (2013.01); H01L 23/528 (2013.01); H01L 23/552 (2013.01); H01L 27/0207 (2013.01); H01L 29/0847 (2013.01); H03K 19/00338 (2013.01);
Abstract

According to embodiments of the present invention, a circuit is provided. The circuit includes forming a first electrical device having a first region of a first conductivity type, forming a second electrical device having a second region of a second conductivity type, and electrically coupling the first region and the second region to each other, wherein one of the first and second regions is arranged to at least substantially surround the other of the first and second regions. According to further embodiments of the present invention, a method of forming a circuit is also provided.


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