The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2021

Filed:

Nov. 11, 2015
Applicant:

Sony Semiconductor Solutions Corporation, Kanagawa, JP;

Inventor:

Toshihiko Watanabe, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/532 (2006.01); H01L 33/62 (2010.01); H01L 23/14 (2006.01); H01L 23/498 (2006.01); H05K 3/46 (2006.01); H01L 23/528 (2006.01); H01L 31/02 (2006.01); H05K 1/02 (2006.01); H05K 1/09 (2006.01);
U.S. Cl.
CPC ...
H01L 23/53295 (2013.01); H01L 23/145 (2013.01); H01L 23/49866 (2013.01); H01L 23/528 (2013.01); H01L 31/02002 (2013.01); H01L 33/62 (2013.01); H05K 3/46 (2013.01); H05K 3/4676 (2013.01); H05K 1/0274 (2013.01); H05K 1/09 (2013.01); H05K 2201/0108 (2013.01);
Abstract

In a case of a multilayer wiring structure in which an insulating layer provided between wires is made of a material having high transmittance of light in a visible range containing ultraviolet rays, wires in the upper layer and those in a lower layer may be recognized together when defects of an upper layer are visually inspected. In this case, the lower layer may be noise for the inspection of the wires in the upper layer, lowering inspection accuracy. This lowered inspection accuracy has inhibited improvement in manufacturing yields and reliability. In order to solve this issue, a multilayer wiring substrate of the disclosure includes: a substrate; and a first wire and a second wire that are provided on the substrate with an insulating layer having a light transmitting property in between, and one or both of which are subjected to a surface treatment.


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