The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 2021
Filed:
May. 15, 2019
Samsung Electronics Co., Ltd., Suwon-si, KR;
Young Kwan Lee, Suwon-si, KR;
Yun Tae Lee, Suwon-si, KR;
Young Sik Hur, Suwon-si, KR;
Ho Kwon Yoon, Suwon-si, KR;
Won Wook So, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A package-on-package includes a first semiconductor package including a first semiconductor chip and a second semiconductor package, disposed on the first semiconductor package, including a second semiconductor chip electrically connected to the first semiconductor chip. Each of the first and second semiconductor chips includes one or more units. The number of units of the first semiconductor chip is greater than the number of units of the second semiconductor chip. The one or more units of the first semiconductor chip and the one or more units of the second semiconductor chip implement a function of an application processor chip.