The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2021

Filed:

Jun. 21, 2016
Applicant:

Robert Bosch Gmbh, Stuttgart, DE;

Inventors:

Peter Taufer, Renningen, DE;

Stefan Butzmann, SchalksmĂĽhle, DE;

Bernd Eckert, Vaihingen an der enz, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/40 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4006 (2013.01); H05K 7/209 (2013.01); H01L 2023/4031 (2013.01); H01L 2023/4081 (2013.01); H01L 2023/4087 (2013.01);
Abstract

A device for cooling a plurality of electrical components, each having a component cooling surface to be cooled, includes a first heat sink, a second heat sink, and a plurality of fasteners. The first heat sink has a first heat-sink cooling surface, and the second heat sink has a second heat-sink cooling surface. The first and second heat-sink cooling surfaces are positioned in a planar arrangement such that the first and second heat-sink cooling surfaces face each other. The first heat-sink cooling surface is configured to receive a first sub-set of the component cooling surfaces of the plurality of electrical components, and the second heat-sink cooling surface is configured to receive a second sub-set of the component cooling surfaces. The fasteners are configured to fasten the first and second heat-sink cooling surfaces to the corresponding component cooling surfaces of the plurality of electrical components to be applied.


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