The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2021

Filed:

Jul. 28, 2017
Applicant:

Commissariat a L'energie Atomique ET Aux Energies Alternatives, Paris, FR;

Inventors:

Emmanuel Marcault, La Bazoche-Gouet, FR;

Jean-Charles Cigna, Toulouse, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/051 (2006.01); H01L 23/367 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/051 (2013.01); H01L 23/3675 (2013.01); H01L 24/83 (2013.01);
Abstract

A method for encapsulating an integrated circuit includes: forming first and second electrically insulating supports each having a planar surface, so as to form a recess in the first support with respect to its planar surface, and so as to form, with respect to the planar surface of each of the first and second supports, first and second reliefs, so that the first and second reliefs of the supports interact; forming a first electrical contact in the recess; positioning a chip in the recess; forming a second electrical contact on the second carrier; and superposing the first and second carriers so as to superpose their reliefs.


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