The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2021

Filed:

Nov. 13, 2017
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Earl Hunter, Lakeway, TX (US);

Russell Duke, Austin, TX (US);

Amitabh Puri, San Jose, CA (US);

Steven M. Reedy, San Ramon, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G05B 19/04 (2006.01); G05B 19/41 (2006.01); H04W 12/06 (2009.01); B24B 37/20 (2012.01); H01L 21/67 (2006.01); G05B 19/042 (2006.01); G05B 19/418 (2006.01); G06K 7/10 (2006.01); H04L 29/06 (2006.01); B24B 1/00 (2006.01); B24B 37/005 (2012.01); B24B 37/30 (2012.01);
U.S. Cl.
CPC ...
H01L 21/67294 (2013.01); G05B 19/0425 (2013.01); G05B 19/4183 (2013.01); G06K 7/10366 (2013.01); H04L 63/0492 (2013.01); H04W 12/06 (2013.01); B24B 1/00 (2013.01); B24B 37/005 (2013.01); B24B 37/20 (2013.01); B24B 37/30 (2013.01); G05B 2219/31322 (2013.01); G05B 2219/45031 (2013.01);
Abstract

Embodiments provided herein provide for methods and apparatus for detecting, authenticating, and tracking processing components including consumable components or non-consumable components used on substrate processing systems for electronic device manufacturing, such as semiconductor chip manufacturing. The semiconductor processing systems and/or its processing components herein include a remote communication device, such as a wireless communication apparatus, for example radio frequency identification (RFID) devices or other devices embedded in, disposed in, disposed on, located on, or otherwise coupled to one or more processing components or processing component assemblies and/or integrated within the semiconductor processing system itself. The processing component may include a single component (part) or an assembly of components (parts) that are used within the semiconductor processing tool.


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