The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2021

Filed:

Apr. 23, 2019
Applicant:

Mikro Mesa Technology Co., Ltd., Apia, WS;

Inventors:

Shyh-Feng Chen, Hsinchu County, TW;

Li-Yi Chen, Tainan, TW;

Fang-Chi Chien, Nantou County, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 23/00 (2006.01); B65G 47/90 (2006.01); H01L 21/677 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67144 (2013.01); B65G 47/90 (2013.01); H01L 21/67721 (2013.01); H01L 24/08 (2013.01); H01L 24/80 (2013.01); H01L 2224/08225 (2013.01); H01L 2224/80085 (2013.01); H01L 2224/80894 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1461 (2013.01);
Abstract

A method for transferring a micro device includes: preparing a carrier substrate with the micro device thereon in which an adhesive layer is present between and in contact with the carrier substrate and the micro device; picking up the micro-device from the carrier substrate by a transfer head comprising a force-adjustable glue layer thereon; forming a liquid layer on a receiving substrate; reducing the grip force of the force-adjustable glue layer of the transfer head to be smaller than a force attaching the micro device to the receiving substrate; placing the micro device over the receiving substrate such that the micro device is in contact with the liquid layer and is gripped by a capillary force; and moving the transfer head away from the receiving substrate such that the micro device is detached from the transfer head and is stuck to the receiving substrate.


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