The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2021

Filed:

May. 08, 2019
Applicant:

Semiconductor Components Industries, Llc, Phoenix, AZ (US);

Inventors:

Chun-Li Liu, Scottsdale, AZ (US);

Ali Salih, Mesa, AZ (US);

Mingjiao Liu, Gilbert, AZ (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 29/20 (2006.01); H01L 23/00 (2006.01); H01L 21/52 (2006.01); H01L 23/492 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4853 (2013.01); H01L 21/52 (2013.01); H01L 23/492 (2013.01); H01L 23/49844 (2013.01); H01L 23/49861 (2013.01); H01L 24/00 (2013.01); H01L 24/49 (2013.01); H01L 24/73 (2013.01); H01L 25/0655 (2013.01); H01L 29/2003 (2013.01); H01L 23/49524 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 24/40 (2013.01); H01L 24/48 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/40227 (2013.01); H01L 2224/40237 (2013.01); H01L 2224/45014 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48237 (2013.01); H01L 2224/49051 (2013.01); H01L 2224/49052 (2013.01); H01L 2224/49111 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73221 (2013.01); H01L 2224/73263 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/00014 (2013.01);
Abstract

In accordance with an embodiment, a semiconductor component includes a support having a side in which a device receiving structure and an interconnect structure are formed and a side from which a plurality of leads extends. A semiconductor device having a control terminal and first and second current carrying terminals and configured from a III-N semiconductor material is mounted to the device receiving structure. A first electrical interconnect is coupled between the first current carrying terminal of the semiconductor device and a first lead. A second electrical interconnect is coupled between the control terminal of the semiconductor device and a second lead.


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