The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2021

Filed:

May. 16, 2018
Applicant:

Lg Display Co., Ltd., Seoul, KR;

Inventors:

Suchan Kwon, Seoul, KR;

ChiKyung Sung, Seoul, KR;

Yonghee Kim, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2006.01); H01L 27/32 (2006.01); G01B 11/24 (2006.01); G01B 17/06 (2006.01); H01L 51/52 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 5/00 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
G06K 9/0002 (2013.01); G01B 11/24 (2013.01); G01B 17/06 (2013.01); G06K 9/0004 (2013.01); H01L 27/323 (2013.01); H01L 51/529 (2013.01); H05K 1/0203 (2013.01); H05K 1/028 (2013.01); H05K 1/0254 (2013.01); H05K 1/189 (2013.01); H05K 5/0017 (2013.01); H05K 7/20963 (2013.01); H01L 27/3225 (2013.01); H01L 27/3227 (2013.01); H01L 2251/5338 (2013.01); H05K 2201/066 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10128 (2013.01); H05K 2201/10151 (2013.01);
Abstract

A display device can include a cover substrate; a display module disposed on a rear surface of the cover substrate and configured to display an image; a heat dissipation film disposed on a rear surface of the display module; a hole disposed in the heat dissipation film; a flexible circuit board covering the hole in the heat dissipation film and configured to block light; and a fingerprint scanner mounted on the flexible circuit board, disposed in the hole of the heat dissipation film, and separated from the heat dissipation film by a space, in which the flexible circuit board covers the space between the heat dissipation film and the fingerprint scanner.


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