The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2021

Filed:

Jan. 04, 2019
Applicant:

Fujitsu Limited, Kawasaki, JP;

Inventors:

Mitsunori Abe, Kawasaki, JP;

Yoshiyuki Hiroshima, Nakano, JP;

Takahiro Kitagawa, Kawasaki, JP;

Naoki Nakamura, Hachioji, JP;

Akiko Matsui, Meguro, JP;

Assignee:

FUJITSU LIMITED, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 30/367 (2020.01); H05K 1/11 (2006.01); G01R 31/28 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
G06F 30/367 (2020.01); G01R 31/2817 (2013.01); H05K 1/115 (2013.01); H05K 3/0005 (2013.01); G01R 31/2846 (2013.01);
Abstract

A recording medium recording a program for a process, the process includes: calculating an amount of distortion in a via of a printed circuit board based on an expression using coefficient m, Δε={(L×α×Δt×E)/(D×T)}×m, where Δε is the amount of distortion, L is a length of the via, α is a thermal expansion coefficient of a base material, Δt is a temperature change of an environment, E is a Young's modulus, D is a diameter of the via, and T is a thickness of plating in the via; and calculating a lifetime of the via based on an expression, M=N/(n×365), where M is the lifetime of the via, n is a frequency of the temperature change, and N is the number of cycles of the lifetime satisfying an expression N=C/Δε.


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