The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2021

Filed:

Aug. 15, 2017
Applicant:

Alliance for Sustainable Energy, Llc, Golden, CO (US);

Inventors:

Todd Gregory Deutsch, Westminster, CO (US);

Myles Aaron Steiner, Denver, CO (US);

Daniel Joseph Friedman, Lakewood, CO (US);

James Luke Young, Golden, CO (US);

Ryan Matthew France, Golden, CO (US);

John A. Turner, Broomfield, CO (US);

Henning Döscher, Berlin, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25B 11/051 (2021.01); C30B 25/18 (2006.01); H01L 31/0216 (2014.01); H01L 31/0304 (2006.01); H01L 31/18 (2006.01); C30B 29/40 (2006.01); C25B 11/057 (2021.01); C25B 11/075 (2021.01); C25B 1/04 (2021.01); H01G 9/20 (2006.01); C25B 1/55 (2021.01);
U.S. Cl.
CPC ...
C25B 11/051 (2021.01); C25B 1/04 (2013.01); C25B 1/55 (2021.01); C25B 11/057 (2021.01); C25B 11/075 (2021.01); C30B 25/18 (2013.01); C30B 29/40 (2013.01); H01G 9/205 (2013.01); H01G 9/2077 (2013.01); H01L 31/02167 (2013.01); H01L 31/03046 (2013.01); H01L 31/1844 (2013.01); H01L 31/1868 (2013.01); Y02E 60/36 (2013.01); Y02P 20/133 (2015.11);
Abstract

An aspect of the present disclosure is a photoelectrochemical device that includes a first cell that includes a first semiconductor alloy, a capping layer that includes a second semiconductor alloy, and a passivating layer that includes a third semiconductor alloy, where the passivating layer is positioned between the first cell and the capping layer, and at least a portion of the capping layer is configured to be in direct contact with an electrolyte.


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