The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 2021
Filed:
Aug. 23, 2017
Applicant:
Lg Chem, Ltd., Seoul, KR;
Inventors:
Seung Hun Yang, Daejeon, KR;
Jung Eun Kim, Daejeon, KR;
Won Tae Joe, Daejeon, KR;
Wonsang Kwon, Daejeon, KR;
Assignee:
Primary Examiner:
Int. Cl.
CPC ...
C08L 9/04 (2006.01); C08J 5/02 (2006.01); C08L 51/00 (2006.01); C08K 5/053 (2006.01); A41D 19/00 (2006.01); C08K 5/10 (2006.01); B29C 41/00 (2006.01); B29C 41/14 (2006.01); B29K 9/00 (2006.01); B29L 31/48 (2006.01);
U.S. Cl.
CPC ...
C08L 9/04 (2013.01); A41D 19/0055 (2013.01); C08J 5/02 (2013.01); C08K 5/053 (2013.01); C08K 5/10 (2013.01); C08L 51/00 (2013.01); B29C 41/003 (2013.01); B29C 41/14 (2013.01); B29K 2009/00 (2013.01); B29L 2031/4864 (2013.01); C08J 2309/04 (2013.01);
Abstract
The present invention relates to a latex composition for dip-molding and a molded article produced therefrom. More specifically, the above composition can be used to prepare the dip-molded articles having gentle syneresis, no stickiness, and excellent chemical resistance by using monoglyceride.
Quick Actions:
Yang, Seung. (2021). Latex composition for dip-molding, and molded article prepared from same (U.S. Patent No. 10927240). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10927240
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile