The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2021

Filed:

Dec. 19, 2018
Applicant:

Facebook Technologies, Llc, Menlo Park, CA (US);

Inventors:

Andrew John Ouderkirk, Redmond, WA (US);

Christopher Yuan Ting Liao, Seattle, WA (US);

Katherine Marie Smyth, Seattle, WA (US);

Thomas John Farrell Wallin, Redmond, WA (US);

Jack Lindsay, Seattle, WA (US);

Austin Lane, Bellevue, WA (US);

Tanya Malhotra, Redmond, WA (US);

Kenneth Diest, Kirkland, WA (US);

Yigit Menguc, Kirkland, WA (US);

Assignee:

Facebook Technologies, LLC, Menlo Park, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 3/12 (2006.01); B29C 48/07 (2019.01); B29C 48/30 (2019.01); B29C 48/35 (2019.01); G02B 27/01 (2006.01);
U.S. Cl.
CPC ...
B29C 48/07 (2019.02); B29C 48/301 (2019.02); B29C 48/304 (2019.02); B29C 48/35 (2019.02); G02B 27/0172 (2013.01);
Abstract

In various embodiments, an electrode precursor material may be flowed into a manifold extrusion die having first and second manifold inlet openings. Further, an electroactive polymer precursor material may be flowed into the manifold extrusion die via a third manifold inlet opening such that the electroactive polymer precursor material is layered between alternating layers of the electrode precursor material from the first and second manifold inlet openings. Moreover, the electrode precursor material and the electroactive polymer precursor material may be extruded through a manifold outlet opening of the manifold extrusion die. Various other methods, systems, apparatuses, and materials are also disclosed.


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