The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 2021
Filed:
Jul. 13, 2017
Canon Kabushiki Kaisha, Tokyo, JP;
Naoko Tsujiuchi, Kawasaki, JP;
Yukuo Yamaguchi, Tokyo, JP;
Mikiya Umeyama, Tokyo, JP;
Satoshi Oikawa, Yokohama, JP;
Hiromasa Amma, Kawasaki, JP;
Takuya Iwano, Inagi, JP;
Satoshi Kimura, Kawasaki, JP;
Yasushi Iijima, Tokyo, JP;
Kyosuke Toda, Kawasaki, JP;
CANON KABUSHIKI KAISHA, Tokyo, JP;
Abstract
There is provided a liquid supply member capable of suppressing deformation of a liquid supply path and decrease in sealing property of a liquid supply path, during molding, and a manufacturing method of the liquid supply member. For that purpose, in die-slide injection molding that combines two components, a protection portion that protects a part of one component easily affected by heat and pressure, is provided on the other component.