The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 2021
Filed:
Sep. 19, 2017
Applicant:
Tamura Corporation, Tokyo, JP;
Inventors:
Masaya Arai, Iruma, JP;
Takeshi Nakano, Iruma, JP;
Atsushi Hori, Iruma, JP;
Tsukasa Katsuyama, Iruma, JP;
Yurika Munekawa, Iruma, JP;
Daisuke Maruyama, Iruma, JP;
Assignee:
TAMURA CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/26 (2006.01); C22C 13/00 (2006.01); C22C 13/02 (2006.01); H01L 23/00 (2006.01); H05K 3/34 (2006.01); B23K 35/02 (2006.01); B23K 35/36 (2006.01); H05K 1/09 (2006.01);
U.S. Cl.
CPC ...
B23K 35/262 (2013.01); B23K 35/025 (2013.01); B23K 35/26 (2013.01); B23K 35/3618 (2013.01); C22C 13/00 (2013.01); C22C 13/02 (2013.01); H01L 24/13 (2013.01); H05K 1/092 (2013.01); H05K 3/3457 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/1132 (2013.01); H01L 2224/11332 (2013.01); H01L 2224/13294 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/3512 (2013.01); H05K 3/3494 (2013.01); H05K 2201/10727 (2013.01); H05K 2201/2045 (2013.01);
Abstract
According to one aspect of the present invention, a lead-free solder alloy includes 2% by mass or more and 3.1% by mass or less of Ag, more than 0% by mass and 1% by mass or less of Cu, 1% by mass or more and 5% by mass or less of Sb, 3.1% by mass or more and 4.5% by mass or less of Bi, 0.01% by mass or more and 0.25% by mass or less of Ni, and Sn.
Arai, Masaya. (2021). Lead-free solder alloy, solder joint, solder paste composition, electronic circuit board, and electronic device (U.S. Patent No. 10926360). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10926360
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile