The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2021

Filed:

Sep. 27, 2015
Applicant:

Yazaki Corporation, Minato-ku, JP;

Inventors:

Satyabrata Raychaudhuri, Thousand Oaks, CA (US);

Yongan Yan, Thousand Oaks, CA (US);

Leonid Grigorian, Camarillo, CA (US);

Assignee:

Yazaki Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F 1/02 (2006.01); B33Y 70/00 (2020.01); B22F 3/00 (2021.01); B22F 3/105 (2006.01); C22C 1/10 (2006.01); C22C 26/00 (2006.01); C22C 32/00 (2006.01); B33Y 10/00 (2015.01); B33Y 40/00 (2020.01); B29C 64/165 (2017.01); B29C 64/314 (2017.01); B29C 64/153 (2017.01); B29C 64/268 (2017.01); B29C 71/04 (2006.01);
U.S. Cl.
CPC ...
B22F 1/02 (2013.01); B22F 3/008 (2013.01); B22F 3/1055 (2013.01); B29C 64/153 (2017.08); B29C 64/165 (2017.08); B29C 64/268 (2017.08); B29C 64/314 (2017.08); B29C 71/04 (2013.01); B33Y 10/00 (2014.12); B33Y 40/00 (2014.12); B33Y 70/00 (2014.12); C22C 1/1084 (2013.01); C22C 26/00 (2013.01); C22C 32/0084 (2013.01); Y02P 10/25 (2015.11);
Abstract

This disclosure relates in general to three dimensional ('3D') printers having a configuration that prepares a three-dimensional object by using a feedstock comprising a metal or a polymer compound and a carbon coating formed on a surface of the compound. This disclosure also relates to such feedstocks and their preparation methods. This disclosure further relates to 3D composite objects prepared by using such printers and feedstocks. This disclosure also relates to carbon containing photocurable formulations and methods for their preparation. This disclosure further relates to electrically conducting 3D polymer composites prepared by using such carbon containing photocurable formulations.


Find Patent Forward Citations

Loading…