The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2021

Filed:

Apr. 23, 2018
Applicant:

Boston Scientific Scimed, Inc., Maple Grove, MN (US);

Inventors:

Joseph Thomas Delaney, Jr., Minneapolis, MN (US);

Patrick Willoughby, Shoreview, MN (US);

David Robert Wulfman, Minneapolis, MN (US);

Andrew J. Ro, Maple Grove, MN (US);

Niraj Gurung, Sauk Rapids, MN (US);

Assignee:

Boston Scientific Scimed, Inc., Maple Grove, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 3/24 (2006.01); C08J 7/04 (2020.01); C08J 7/056 (2020.01); C08L 23/18 (2006.01); C08L 23/22 (2006.01); D01D 5/08 (2006.01); D01D 5/18 (2006.01); D02G 3/36 (2006.01); A61L 27/16 (2006.01); C08L 53/00 (2006.01); A61L 27/48 (2006.01); D01D 5/00 (2006.01); D01D 5/098 (2006.01);
U.S. Cl.
CPC ...
A61L 27/16 (2013.01); A61L 27/48 (2013.01); C08J 3/246 (2013.01); C08L 53/00 (2013.01); D01D 5/003 (2013.01); D01D 5/0023 (2013.01); D01D 5/0985 (2013.01); A61L 2430/20 (2013.01); C08J 2323/18 (2013.01); C08J 2323/22 (2013.01); C08J 2337/00 (2013.01); C08J 2479/02 (2013.01); C08L 2203/02 (2013.01); D10B 2509/06 (2013.01);
Abstract

Aspects herein relate to biocompatible polyisobutylene-fiber composite materials and related methods. In one aspect a biocompatible composite material is included. The biocompatible composite material can include a network of fibers comprising one or more polymers to form a substrate and a continuous, interpenetrating polyisobutylene matrix that is non-porous and completely surrounds the electrospun fibers. Other aspects are included herein.


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