The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2021
Filed:
Mar. 27, 2018
Jx Nippon Mining & Metals Corporation, Tokyo, JP;
Yuki Ori, Ibaraki, JP;
Hideta Arai, Ibaraki, JP;
Atsushi Miki, Ibaraki, JP;
Ryo Fukuchi, Ibaraki, JP;
JX Nippon Mining & Metals Corporation, Tokyo, JP;
Abstract
The present invention provides a surface treated copper foil in which a dropping of the roughening particles from a roughening treatment layer on the surface of the copper foil is suppressed and an occurrence of wrinkles or stripes when bonding with an insulating substrate is suppressed. The surface of the roughening treatment layer satisfies one or more of the following: a roughness Ra is 0.08 to 0.20 μm, a roughness Rz is 1.00 to 2.00 μm, a roughness Sq is 0.16 to 0.30 μm, a roughness Ssk is −0.6 to −0.35, a roughness Sa is 0.12 to 0.23 μm, a roughness Sz is 2.20 to 3.50 μm, a roughness Sku is 3.75 to 4.50, and a roughness Spk is 0.13 to 0.27 μm, a glossiness of a TD of the surface of the side of the roughening treatment layer of the surface treated copper foil is 70% or less.