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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10925170 B1

PDFFull Text
Date of Patent:
Feb. 16, 2021

Filed:

Mar. 16, 2018

Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device

Applicant:

Jx Nippon Mining & Metals Corporation, Tokyo, JP;

Inventors:

Yuki Ori, Ibaraki, JP;

Hideta Arai, Ibaraki, JP;

Atsushi Miki, Ibaraki, JP;

Ryo Fukuchi, Ibaraki, JP;

Assignee:

JX Nippon Mining & Metals Corporation, Tokyo, JP;

Attorney:

Nields, Lemack & Frame, LLC

Primary Examiner:

Seth Dumbris

Int. Cl.
CPC ...
C25D 7/04 (2006.01); H05K 3/22 (2006.01); H05K 1/09 (2006.01); H05K 3/46 (2006.01); C25D 5/16 (2006.01); H05K 3/38 (2006.01); C25D 7/06 (2006.01); C25D 5/12 (2006.01); C25D 5/10 (2006.01); C25D 7/00 (2006.01); C25D 3/38 (2006.01); C25D 3/56 (2006.01); H05K 3/20 (2006.01); C25D 1/04 (2006.01); C25D 3/58 (2006.01); C25D 11/38 (2006.01); C25D 3/12 (2006.01); C25D 5/02 (2006.01);
U.S. Cl.
CPC ...
H05K 3/22 (2013.01); C25D 5/10 (2013.01); C25D 5/12 (2013.01); C25D 5/16 (2013.01); C25D 7/00 (2013.01); C25D 7/0614 (2013.01); H05K 1/09 (2013.01); H05K 3/384 (2013.01); H05K 3/4652 (2013.01); H05K 3/4682 (2013.01); C25D 1/04 (2013.01); C25D 3/12 (2013.01); C25D 3/38 (2013.01); C25D 3/562 (2013.01); C25D 3/58 (2013.01); C25D 5/022 (2013.01); C25D 11/38 (2013.01); H05K 3/205 (2013.01); H05K 3/389 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0338 (2013.01); H05K 2201/0355 (2013.01); H05K 2203/0156 (2013.01); H05K 2203/0307 (2013.01); H05K 2203/0723 (2013.01); Y10T 428/12431 (2015.01);
Abstract

The present invention provides a surface treated copper foil in which a dropping of the roughening particles from a roughening treatment layer provided on the surface of the copper foil is favorably suppressed and an occurrence of wrinkles or stripes when bonding with an insulating substrate is favorably suppressed. The surface treated copper foil comprises a copper foil, and

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