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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10925164 B1

PDFFull Text
Date of Patent:
Feb. 16, 2021

Filed:

Sep. 12, 2017

Stackable passive component

Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Paul A. Martinez, Morgan Hill, CA (US);

Curtis C. Mead, Sacramento, CA (US);

Scott D. Morrison, Watertown, MA (US);

Giancarlo F. De La Cruz, San Jose, CA (US);

Lin Chen, Saratoga, CA (US);

Albert Wang, Sunnyvale, CA (US);

Brad W. Simeral, San Francisco, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:

Fletcher Yoder PC

Primary Examiner:

Jared Fureman

Assistant Examiner:

Nicolas Bellido

Int. Cl.
CPC ...
H05K 1/18 (2006.01); H03H 1/00 (2006.01); H03H 7/01 (2006.01); H03H 7/38 (2006.01); H05K 3/34 (2006.01); H01G 4/30 (2006.01); H01G 2/06 (2006.01); H01G 4/40 (2006.01); H01G 4/228 (2006.01); H01G 4/12 (2006.01); H01F 27/29 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H01G 2/06 (2013.01); H01G 4/30 (2013.01); H01G 4/40 (2013.01); H03H 7/0115 (2013.01); H03H 7/38 (2013.01); H05K 3/3436 (2013.01); H01F 27/29 (2013.01); H01G 4/12 (2013.01); H01G 4/228 (2013.01); H03H 1/00 (2013.01); H03H 2001/0085 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/1006 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/10515 (2013.01); H05K 2201/10636 (2013.01); Y02P 70/50 (2015.11);
Abstract

Methods and systems for producing circuitry using stackable passive components are discussed. More specifically, the present disclosure provides designs and fabrication methods for production of stackable devices that may be used as components in circuitry such as filters and impedance matching adaptors. Such components may be used to save space in printed circuit boards. Moreover, stackable passive components may be dual components, which may be improve the electrical performance in certain types of circuits such as matched component filters.

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