The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2021
Filed:
Jan. 10, 2020
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Je Sang Park, Suwon-si, KR;
Sang Ho Jeong, Suwon-si, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
H05K 1/119 (2013.01); H05K 1/111 (2013.01); H05K 1/112 (2013.01); H05K 1/115 (2013.01); H05K 1/116 (2013.01); H05K 1/16 (2013.01); H05K 1/183 (2013.01); H05K 1/185 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/09227 (2013.01);
Abstract
A printed circuit board includes an insulating layer including a cavity including a groove structure formed on one surface of the insulating layer, a circuit pattern including a first pad formed on a bottom surface of the cavity and a second pad formed inside the insulating layer, a first metal layer embedded in a side surface of the cavity, the first metal layer being in contact with the bottom surface of the cavity and being formed along the boundary of the cavity, and a second metal layer formed on the second pad and having a stepped structure formed with the second pad.