logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10925148 B1

PDFFull Text
Date of Patent:
Feb. 16, 2021

Filed:

Jul. 31, 2017

Printed circuit board assembly

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Seok-hun Kang, Suwon-si, KR;

In-beom Kim, Suwon-si, KR;

Bo-ram Kim, Suwon-si, KR;

Soo-hong Kim, Seoul, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Anatoly Vortman

Assistant Examiner:

Zhengfu J Feng

Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 7/20 (2006.01); H05K 1/18 (2006.01); H05K 3/30 (2006.01); H05K 3/42 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0206 (2013.01); H05K 1/00 (2013.01); H05K 1/02 (2013.01); H05K 1/0203 (2013.01); H05K 1/18 (2013.01); H05K 7/20 (2013.01); H05K 7/20509 (2013.01); H05K 1/181 (2013.01); H05K 3/30 (2013.01); H05K 3/3447 (2013.01); H05K 3/429 (2013.01); H05K 2201/066 (2013.01); H05K 2201/1056 (2013.01); Y02P 70/50 (2015.11);
Abstract

A printed circuit board assembly is provided. A printed circuit board assembly includes a printed circuit board; an electronic component mounted on the printed circuit board; a heat radiating member which contacts the electronic component and is configured to receive and conduct heat generated by the electronic component; and at least one connection part connecting the printed circuit board and the heat radiating member to each other and configured to transfer the heat conducted through the heat radiating member to the printed circuit board.

Find Patent Forward Citations

Loading…